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UPB1009K
NOTES
ON
CORRECT
USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent abnormal oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor to the V CC pin.
(5) High-frequency signal I/O pins must be coupled with the external circuit using a coupling capacitor.
RECOMMENDED
SOLDERING
CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200 ° C or higher
Preheating time at 120 to 150 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215 ° C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
: 120 ° C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
VP215
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
27
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